patentit
 

Patentit ja julkaisut

Omat patentit ja julkaisut

  • Esju and Nokia Networks Use NI AWR Design Environment for Designing Switching-mode Power Amplifiers, 2014, http://www.awrcorp.com/customer-stories/esju
  • E. Koukkari, P. Kurttio, EP-05757054.1, Power source and method for controlling operational power, 2014
  • M. Vahtola, M. Piiroinen, T. Tarvainen, Extremely Wideband Spurious Responses Filtering Requirements Definition and Filter Realization with Electromagnetic Cavity Attenuation, IEEE APWC 2013
  • E. Koukkari, A. Heiskanen, V.-M. Holappa, J. Peltokorpi, M. Piiroinen, T. Tarvainen, S. Lanfranco, T. Kolmonen, H. Somerma s, Simulation And Measurement Based Switching Mode Power Amplifier Design Process, AWR Workshop, EUMWEEK 2013
  • E.Koukkari, P. Kurttio, USA 8,063,513, Power source and method for controlling operational power, 2011
  • J.Turunen, T.Tarvainen, A. Hekkala, S.Ihme, T.Reinvuo and P.Tamminen, ”Switch Based Non-Linear Models for System Level 3-D ESD Simulations”. EMC Europe 2011 Symposium York, England, September 26 – 30, 2011.
  • T. Reinvuo, T. Tarvainen, T. Viheriäkoski and P. Tamminen, “Ground Discharge Effect to the Sensitive Component in the Charged Board Type of Electrostatic Discharge”. 9th International Symposium on EMC, Wroclaw, Poland, September 13-17, pp. 766 – 768, 2010.
  • T. Reinvuo, T. Tarvainen, T. Viheriäkoski and P. Tamminen, “Electrostatic Discharge Measurement and Simulation of a Charged Power Amplifier Board”. 39th European Microwave Conference, Rome, Italy, 29 September-01 October, pp. 292 – 294, 2009.
  • Koukkari Eero, Kurttio Pasi “Power source and method for controlling operational power”, Patent 119575, 2008-12-31.
  • T. Reinvuo, T. Tarvainen, T. Viheriäkoski, “Simulation and Physics of Charged Board Model for ESD”, EOS/ESD Symposium, 2007, Anaheim, USA.
  • L. Hynynen, T. Tarvainen, M. Rouvala, A. Renko, “On the Effect of Mobile Device Shape Characteristics to Interconnection Noise Coupling to an RF Chip Antenna”, 15th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2006.
  • M. Vahtola, T. Tarvainen, “Statistical Analysis of the PWB Resonance Suppression with Randomly Positioned Grouns Vias”, International Symposium on Electromagnetic Compatibility . EMC Europe 2006, pp. 537-539.
  • T. Tarvainen, L. Hynynen, M. Rouvala, A. Renko, “On the Effect of High Speed Connector Shields Distributed Contact Resistance to Radiated Emissions”, International Symposium on Electromagnetic Compatibility . EMC Europe 2006, pp. 157-160.
  • M. Vahtola, T. Tarvainen, “Computationally Efficient FIT Characterization and Measurement of EMC Gaskets”, International Conference on Electromagnetics in Advanced Applications . ICEAA05, pp. 487-490.
  • Koukkari Eero “Amplitude Controller”, Patent 116108, 2005-09-15
  • A. Hekkala, T. Tarvainen, “Screening Attenuation of Differential Cable-Connector Assemblies” 8th IEEE Workshop on Signal Propagation on Interconnects- SPI2004, pp. 175-178.
  • T. Tarvainen, R. Mäkinen, M. Vahtola, “Application and modeling of Via Fences With Different Via Diameters,” International Conference on Electromagnetics in Advanced Applications – ICEAA03, pp. 303-306
  • M. Vahtola, T. Tarvainen “Analysis of Coupled Signal Vias with Circularly Positioned Surrounding Ground vias,” International Conference on Electromagnetics in Advanced Applications – ICEAA03, pp. 299-302.
  • A. Hekkala, T. Tarvainen, “High Frequency Shielding Effectiveness of Small Metal Cans,” International Symposium on Electromagnetic Compatibility- EMC Europe 2002, pp. 327-332.
  • M. Vahtola, T. Tarvainen, “Microwave Testing of Electromagnetic Shielding on Printed Wiring Boards,” International Conference on Advanced Applications in Electromagentics – ICEAA01, 2001, pp. 339-342.
  • J. Kolehmainen, T. Tarvainen, “On 2-D Transmission Line Modeling of Power and Ground Planes in Multilayer Structures,” IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, 2000, pp. 95-98.
  • T. Tarvainen, “Simplified Modeling of Parallel Plate Resonances on Multilayer Printed Circuit Boards,” IEEE Trans. Electromagn. Compat., Vol. 42, pp. 284-289, Aug. 2000.
  • T. Tarvainen, Studies on Via Coupling on Multilayer Printed Circuit Boards, Dissertation, University of Oulu, 1999, 87 pp.
  • T. Tarvainen, Häiriösuojatun ja vaimennetun huoneen suunnittelu, Lisensiaatintyö, Oulun yliopisto, sähkötekniikan osasto, 1997, 86 s.

Esitelmämateriaaleja

Keksintöjä yhteistyössä asiakkaidemme kanssa

  • ”Adjusting Circuit”, Patent BRPI0507158, 2007-06-26.
  • “Electronic Circuit”, Patent BRPI0507154, 2007-06-26.
  • “Power Source and Method for Controlling Operational Power” Patent EP1766773, 2007-03-28.
  • “Method for Determining the RF Shielding Effectiveness of a Shielding Structure”, Patent US2006170430, 2006-08-03.
  • “System and Method for Auto-Bias of an Amplifier”, Patent DE60018218T, 2005-12-29.
  • “Method of Producing Electronic Unit of Radio System and Electronic Unit”, Patent US2004052035, 2004-03-18.
  • “Method of Tuning a Summing Network” Patent US2003155992, 2003-08-21.
  • “Method and Arrangement for Gain Control”, Patent US2003069049, 2003-04-10.
  • “Method and Apparatus for Improved Feed Forward Amplification”, Patent WO0141299, 2001-06-07.
  • “Device and Method for Tuning a Band-Pass Filter Utilizing Mixing Results with DC Component Removed”, Patent US5757247, 1998-05-26.
  • “Method and Arrangement for Tuning a Combiner Filter” Patent US5638034, 1997-06-10.
  • “Device and Method for Tuning a Combiner Filter” Patent US5525940, 1996-06-11.